High Temperature Laminates

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Download our FREE Microwave Laminates Comparison Chart.  Makes a great reference tool for engineers.

High temperature laminates are available through the use of different resin systems.  Multifunctional epoxy, PPO, and polyimide are the most widely available.  Below is a chart of high temperature materials and their basic operating properties.

Note: Values are for 0.059" thickness.

Laminate Comparison Chart

PART NUMBER ED130  GETEK FR408 45N N4000-13 P95
RESIN SYSTEM FR4 PPO MFE MFE MFE Polyimide
SUPPLIER Isola GE  Isola Arlon Nelco Isola

THERMAL PROPERTIES

           
Tg (typical) °C DSC 135 N/A 180 180 207 260
Tg (typical) °C TMA N/A N/A 165 N/A 178 250
Tg (typical) °C DMA N/A 180 219 N/A 245 N/A
CTE - x axis (ppm/°C) 14 N/A 13 15 N/A 14
         - y axis (ppm/°C) 13 N/A 13 15 N/A 17
         - z axis (ppm/°C) 175 3.80% 70 55 55 55
T-288 Test (seconds @ 288°C) >120 N/A >600 N/A N/A >1200

ELECTRICAL

ED130  GETEK FR408 45N N4000-13 P95
Permittivity (Dk) max @            
1 MHz 4.7 3.75 4.57 4.5 4.5 4.4
Loss Tangent (DF) max @            
1 MHz 0.02 0.009 .019 .025 .007 .016
Electrical Strength (volts/mil) 1200 1500 1400 1500 N/A 1300
Volume Resistivity (megohms-cm) 8x10(7) 1x10(6) 1x10(8) 2.6x10(7) N/A 4x10(8)
Surface Resistivity (megohms) 2x10(5) 1x10(4) 1x10(6) 2.9x10(7) N/A 4x10(8)
Arc Resistance (seconds) 100 60 120 65 N/A 131

PHYSICAL

ED130  GETEK FR408 45N N4000-13 P95
Water Absorption % 0.25% 0.12% 0.20% 0.10% N/A 0.19%
Peel strength (1 oz) 9 8.5 8 8 N/A 7
Peel strength (1oz) after thermal stress 9 8.5 6 8 N/A 5.5

CERTIFICATIONS

           
Flammability (UL94) 94V-0 94V-0 94V-0 94V-0 N/A 94H-B
IPC 4101 spec. sheet # /21 /25 /24 /24 N/A /41
MIL SPEC ID GF/GFN GF/GFG GF/GFG GF/GFG N/A GI/GIL

MFE - Multi-Functional Epoxy, PPO - Polyphenylene Oxide, DSC - Differential Scanning Colorimetry, TMA - Thermal Mechanical Analysis, DMA - Dynamic Mechanical Analyzer, N/A - data not available.

Data in Italics represents results from independent testing.

REFERENCES

1. EHRLER, Sylvia , A Review of Epoxy Materials and Reinforcements, Part One, PC Fab April, 2002

Disclaimer: All data above was derived from published documents made available to us from the manufacturers.  Although we believe the data to be accurate, Standard Printed Circuits, Inc. is not liable for any inaccuracies that may exist in the data provided.  All materials should be thoroughly tested by the user for the intended application.

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