Download our FREE Microwave Laminates Comparison Chart.  Makes a great reference tool for engineers.


Single-sided PCB
Single-sided printed circuits represent the least sophisticated (and thereby least costly) of the printed circuit products.  These boards usually do not require plated through holes and only have a circuit pattern on 1 side.  Quite often single-sided boards are referred to 'punch and crunch' due to the fact that high volume runners are profiled with tool and die.

Double-sided PCB
Double-sided printed circuits are a step above single-sided in their complexity.  Double sided PCBs require plated through holes to provide better anchoring for soldered components and front to back electrical continuity.  Most designs require soldermask front and back along with a silkscreen layer for component designators.  Very often double sided designs utilize a mixed technologies of through hole (PTH) and surface mount (SMT).

Multilayer PCB
Multilayer printed circuits consist of 3 or more circuit layers bonded together by a thickness of insulating material called prepreg.  Prepreg is B stage epoxy impregnated fiberglass.  Multilayers are generally considered to be the most sophisticated printed circuit product due to their construction methods and design complexities. 

RF/ Microwave
Most RF PCB designs are considered to be functional components of the assembled sub-system.  These designs utilize various patterns in the circuitry to achieve changes in the characteristics of the RF energy field.  Tight line width tolerances and front to back registration are considered to be the rule when fabricating these PCBs.  Exotic materials such as: PTFE, Duroid, and ceramics are often utilized for their stability and dielectric properties.

SMOBC-HAL (surface mount technology SMT)
Soldermask Over Bare Copper usually provided with a Hot Air Level (HAL) solder finish which selectively places solder onto pads and holes only.  This provides an excellent base for attaching SMD components.

Alternative Finishes (Including RoHS Compliant Finishes)
We offer a variety of different surface finishes including: Gold, nickel, tin, solder reflow, bare copper with anti-oxidant, silver, and rhodium.  Thicknesses can vary according to your specification (see Engineering for default thicknesses).

Panelization Options
We can provide accurate scored and/or routed arrays to optimize your assembly process.  Typically, an 8" x 10" panel is the most cost effective size due to 'best yield' from our standard panel size.

High Performance Laminates
From multifunctional epoxy resin systems to high performance polyimide,  we offer a wide selection of laminates (see Laminates).  Some of the multifunctional epoxies are approaching polyimide in high temperature performance.

Manufacturing Capabilities:

Layers: 1-12 FR4, polyimide, multifunctional, and multilayer RF
Lines/Spacings (mils): 6/6 production, 4/4 prototype
SMT minimum pitch (mils): 18
Minimum finished hole size (mils): 10
Aspect ratio (max.): 6:1
Blind / Buried vias yes, with some restrictions
Available finishes: SMOBC-HAL, solder reflow, electroless tin (20-30 µi), immersion tin (10-15 µi) , nickel, gold, bare copper (with CU-56 antioxidant), immersion silver.
Soldermasks: Liquid Photoimageable (LPI).
Soldermask Colors: green, blue, red, black, clear
Silkscreen Liquid Photoimageable, epoxy based thermal cure.
Silkscreen Colors: white, yellow, black
Minimum LPI Mask Resolution (mils): 4
Copper Foil: minimum 1/2 oz., maximum 3oz with mask or silk - 5oz without mask or silk
Electrical Test: grid test or flying probe netlist testing
Laminate Thicknesses: 0.005" - 0.250"
Lead Times: single-sided protos - 24-48 hrs.
double-sided protos - 48-72 hrs. (includes RF boards)
quickturn single and double-sided - 5 days
multilayer protos - 5-10 days
normal lead times - 2-3 wks
note: lead times are calculated from the time the PO is received to the time the product is shipped.  If the PO (and gerber files) are received by Noon we will count that as day one.
Line width etching tolerances 1/2 oz. foil - +/- .001", 1 oz foil - +/- .002"
Special Processes: peelable soldermask
Panel sizes: min - 6" x 9", max - 18" x 24"
QA / Testing: Quality system compliant with ISO 9000, inspection to IPC-A-600 (current rev.) Class 2, solderability testing to IPC-TM-XXX, electrical test, cross-sectioning lab, coating thickness testing, PTH thickness testing, calibration system to MIL-STD-45662, UL-94V0 (94V1 for polyimide).

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